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Metal Terminal Type
C03E.pdf
May.17,2013
KCM Series
AEC-
Q200
Anti- Deflecting Soldering
noise crack crack
By bonding metal terminals to the external electrodes of the chip, the problem of
how to design a capacitor to enable it to be mounted on a large MLCC has been
solved!
Features
1
Bond the metal terminals to the external electrodes of the chip.
The stress on the chip is reduced due to the elastic behavior of the metal terminals.
Ceramic
Internal Electrode
Noise
Board Bending Cracks
Solder Cracks
Lead-free High
Temperature
Solder
Metal Terminal
Noise due to cracks or vibration of the capacitor caused by
mechanical stress applied to the board was a design issue.
Stress is reduced due to the elastic behavior of the metal terminals!
2
Noise, board deflection cracks, and solder cracks are greatly reduced.
No breakage occurs even when the board deflection is 6mm.
Solder cracks were not found even after 2000 heat stress cycles.
C omparison of Noise Reduction Effe ct
Stress caused by board deflection is reduced.
80
60
40
Approx. 30dB reduction!
100
80
60
Metal Terminal
(2220/630V/220nF)
Does not
break even
at 6 mm!
40
20
0
20
0
Chip Capacitor
(2220/630V/220nF)
Chip Capacitor
With Metal Terminals
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Deflection Amount (mm)
Evaluation Items: 2220 size/DC630V/220nF
Test Conditions: 50V, AC10Vp-p/3kHz
Sample Board: Glass-epoxy Board (T: 1.6mm)
Number of samples: 3
Distance between microphone and board: 3mm
Note: Results obtained using Murata’s evaluation board
Solder cracks due to heat stress are reduced.
Chip Size
Individual Chip (2220 size)
Metal Terminal (2220 size)
1000 cycles
Solder cracks
2000 cycles
Compared to an individual chip, the addition
of metal terminals results in excellent solder
38
Solder cracks
Test Conditions: -55 to +125°C, 5 minutes (liquid phase)
Board used: Glass-epoxy Board (FR-4)
cracking resistance.
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制造商:Murata Manufacturing Co Ltd 功能描述:
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